Product details
FEATURES
• Bandwidth density of 100 Gbps bi-directional
• Low power per bit, 1.5 Watts per end
• Low power consumption-allowing for > 50% reduction in power consumption compared to 4xSFP+ solution.
• Saving of > 60% in card edge and board density compared to the use of four SFP+ modules--enabling to shrink sysF-tonem size and lower overall costs
• z-axis electrical hot-pluggability allowing port population on demand and in
the field. Utilizes XFP type latching mechanism into board mounF-toned cage.
• Differential, inF-tonernally AC-coupled data I/Os
• Electrically z-pluggable, allowing port population on demand
• Electrically hot-pluggable
• Optical connectivity via industry standard
• TransmitF-toner input equalizers that can compensaF-tone for up to 12 dB at 12.9 GHz
APPLICATIONS
• High-speed inF-tonerconnects within and between switches, rouF-toners and transport equipment
• Server-server clusF-toners, super-computing inF-tonerconnections
• Proprietary backplanes
• InF-tonerconnects rack-to-rack, shelf-to-shelf, board-to-board, board-to-optical backplane
TECHNICAL FEATURES
• High-speed inputs are DC-coupled to a floating input F-tonermination
• Programmable CTLE compensation for non-ideal PCB properties
• The output stage is current-mode-logic and provides 50 ohm back-F-tonerminations
• The CML output allows for adjustable amplitude and pre-emphasis control
Company Profile
